The AC65i wireless module features:
JAVA (AC65i): CLDC HotSpot Implementation 1.1.2, Java ME profile IMP-NG, Secure data transmission with HTTPS and PKI, Improved power-saving modes, Multi-threading, On-device-debugging Antenna Diagnostics eCall prepared EDGE Class 12 GPRS Class 12 Advanced Temperature Management RLS Monitoring Embedded Processing
Specification:
The AC75i wireless module features:
EDGE (E-GPRS) multislot class 12 (AC75i) Antenna Diagnostics eCall prepared EDGE Class 12 GPRS Class 12 Advanced Temperature Management RLS Monitoring Embedded Processing
Specification:
BGS3 LGA Basic GPRS (Ex VAT)
M.O.Q. 600 pieces
Email:
sales@gprsmodems.co.uk for details.
Solderable GPRS connectivity
The BGS3 module provides all the necessary features for a wide range of cellular M2M applications. TCP/IP, serial interfaces and GPRS data rates up to 43 kbps together with outstanding LGA technology for easy and reliable automated manufacturing makes the BGS3 the module of choice for customers in tracking and tracing, healthcare, POS terminals, industrial computing and more.
The BGS3 wireless module features:
LGA 119 pads mounting technology GPRS Class 10 for 43 kbps in uplink and 86 kbps in downlink Quad-Band (850/9000/1800/1900 MHz) RIL driver for MS Windows Mobile 6.1 based devices TCP/IP over AT Two serial interfaces Extended temperature range: -40°C to +85°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) !! Specification:
EES3 LGA GPRS + EDGE (Ex VAT)
M.O.Q. 600 pieces
Email:
sales@gprsmodems.co.uk for details.
The BGS3 module provides all the necessary features for a wide range of cellular M2M applications. TCP/IP, serial interfaces and GPRS data rates up to 43 kbps together with outstanding LGA technology for easy and reliable automated manufacturing makes the BGS3 the module of choice for customers in tracking and tracing, healthcare, POS terminals, industrial computing and more.
The BGS3 wireless module features:
LGA 119 pads mounting technology GPRS Class 10 for 43 kbps in uplink and 86 kbps in downlink Quad-Band (850/9000/1800/1900 MHz) RIL driver for MS Windows Mobile 6.1 based devices TCP/IP over AT Two serial interfaces Extended temperature range: -40°C to +85°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) !! Specification:
EGS3 LGA GPRS (Ex VAT) M.O.Q. 600 pieces
Email:
sales@gprsmodems.co.uk for details.
Enhanced EGS3 M2M features, such as integrated TCP/IP stack, GPRS class 12 and an array of industrial interfaces (SPI, USB, I2C, serial interfaces) provide the foundation for customer solutions in a wide range of industrial M2M applications. The EGS3 module combines M2M features with the easy and reliable automated manufacturing LGA technology.
The EGS3 wireless module features:
LGA 119 pads mounting technology GPRS Class 12 for both 86 kbps in uplink and downlink Quad-Band (850/9000/1800/1900 MHz) TCP/IP over AT USB, I2C, SPI Two serial interfaces Extended temperature range: -40°C to +85°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) Remote SIM access Specification:
EGS5 LGA GPRS + JAVA (Ex VAT) M.O.Q. 600 pieces
Email:
sales@gprsmodems.co.uk for details.
The EGS5 is a high-performance, open-platform module powered by the JavaTM virtual machine. By combining the advantages of easy and reliable automated manufacturing with fast application design and development, the EGS5 module cuts development and manufacturing costs and increases ROI.
The EGS5 wireless module features:
LGA 119 pads mounting technology GPRS Class 12 for both 86 kbps in uplink and downlink Quad-Band (850/9000/1800/1900 MHz) Java IMP-NG Virtual Machine open platform TCP/IP over AT USB, I2C, SPI, two serial interfaces Extended temperature range: -40°C to +85°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) Remote SIM access !!
Specification:
HSDPA ready to Integrate
The HC25 supports both Quad-Band GSM/GPRS/EDGE and Tri-Band UMTS/HSDPA functionality, enabling mobile devices and solutions such as PDA or industrial handhelds to cover all the frequencies used worldwide. The 3.6 Mbit/s HSDPA module offers RIL/NDIS/USB driver, full voice and data support and a robust mounting and interface concept. This ensures a short time-to-market and cost-efficient development as well as extended service continuity.
The HC25 wireless module features:
HSDPA 3.6 Mbit/s Tri-band HSDPA/UMTS: 850/1900/2100 MHz Quad-band GSM/GPRS/EDGE: 850/900/1800/1900 MHz full voice and data support GPS Serial interface and USB interface USB 2.0 full speed NDIS/USB and Multiplex driver for Microsoft© Windows XP™ and Vista™-based devices RIL/NDIS/USB driver for devices based on Microsoft© Windows Mobile™ 6 R&TTE, GCF, CE, FCC, PTCRB and operator approvals Extended Temperature Range: -30°C to +75°C (restricted operation) Technical Specification:
MC55i: Quad-band, miniaturized
It’s just 35 x 32.5 x 2.95 mm, but packed with impressive features: Quad-Band GPRS class 10, a TCP/IP stack, a RIL driver. The MC55i comes as all-round module suitable for a host of fields: security, vending, metering, gateways, remote maintenance and control, routers and a great deal more. The Quad-Band technology allows the module to be used anywhere in the world.
The RIL driver for Microsoft© Windows Mobile™ 6-based devices comes free of charge and simplifies the development of smart phones, PDAs and industrial handhelds.
The key features of the MC55i at a glance:
GPRS Class 10 for 43 kbps in uplink and 86 kbps in downlink Quad-Band (850/9000/1800/1900 MHz) 50 pin B2B connector RIL driver for MS Windows Mobile 6.1 based devices TCP/IP over AT Two serial interfaces Extended temperature range: -40°C to +70°C
The MC75i wireless module features:
•EDGE Class 12 for both 236 kbps in uplink and downlink
•GPRS Class 12 for both 86 kbps in uplink and downlink
•Quad-Band (850/9000/1800/1900 MHz)
•80 pin B2B connector
•RF connector
•Additional antenna soldering pad
•TCP/IP over AT
•RIL driver for MS Windows Mobile 6.1 based devices
•USB, I2C, SPI, two serial interfaces
•Extended temperature range: -40°C to +75°C
•Radio Link Stability (RLS) monitoring (e.g. for jamming detection)
•Remote SIM access
Specification:
The TC63i wireless module features:
GPRS Class 12 for both 86 kbps in uplink and downlink Quad-Band (850/9000/1800/1900 MHz) 80 pin B2B connector RF connector Additional antenna soldering pad TCP/IP over AT USB, I2C, SPI Two serial interfaces Extended temperature range: -40°C to +75°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) Remote SIM access !! Specification:
The TC65i wireless module features:
GPRS Class 12 for both 86 kbps in uplink and downlink Quad-Band (850/9000/1800/1900 MHz) 80 pin B2B connector RF connector Additional antenna soldering pad TCP/IP over AT Java IMP-NG Virtual Machine open platform USB, I2C, SPI, two serial interfaces Extended temperature range: -40°C to +75°C Radio Link Stability (RLS) monitoring (e.g. for jamming detection) Remote SIM access !! Specification:
With the XT65, M2M developers can implement tracking functions and the associated options more simply and economically than ever. The logical linking of GPS and GSM technology optimises the combination of these two technologies. Moreover, complex M2M applications can be developed on the Java™ platform within very short development times.
State-of-the-art GPS receiver (16 channels) Quadband GSM (850/900/1800/1900 MHz) GPRS multi-slot class 12 JavaTM IMP-NG Integrated TCP/IP stack RIL driver for Microsoft© Windows MobileTM based devices
Specification
Thanks to the XT75, the integration of tracking functions and the associated options is now simpler and cheaper than ever. The XT75 is the first module that links GPS and GSM technology logically which consequently optimises the combination of these two technologies. Add to that the integrated JavaTM Open Platform, which offers a complete application platform for developing complex M2M solutions.
State-of-the-art GPS receiver (16 channels) Quadband GSM (850/900/1800/1900 MHz) EDGE (E-GPRS) multi-slot class 10 Java™ IMP-NG Integrated TCP/IP stack RIL driver for Microsoft© Windows MobileTM based devices
Specification:
